Effect of underfill microstructure on solder life and observing crack initiation and propagation on solder in semiconductor package under thermal cyclic load.
Choosing the right composite for underfill is extremely important for solder life of your PCB. Using Non-linear homogenization, Multiscale.Sim can evaluate material property of underfill and predict crack initiation and propagation.
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- Brief introduction about multiscale analysis
- Overview of Multiscale.Sim
- Analysis of crack initiation and propagation using Multiscale.Sim
- Need for a Total Material Test - collaboration with Ansys Granta