Reliability Design of Composite Materials Based on Virtual Material Test

• Published: July 2024
• Yamamoto Koji, Department of Engineering, Cybernet Systems Co., Ltd, Japan

Abstract

The importance of improving the product performance by material design is starting to be recognized. For example, weight reduction has been achieved by structural design change, which can be done by shape optimization and topology optimization analysis in CAE. These optimization techniques, based on sensitivity evaluation, have been used over decades and, also have been the solution to overcome the over-reliance on craftsman's intuition and experiences. However, structural design change has its own limit. The need for material design change has been further noticed in improving the product functionality and finding the solutions for environmental degradation.

As an example, large-scale weight reduction to improve fuel efficiency in transportation vehicles can be achieved by using multi-material parts. In electronic boards, traditionally used eutectic solder (i.e. lead-based solder) is restricted by the RoHS Directive [1] due to its toxicity. So, application of lead-free material is required. In such case, new material design parameter is not limited to focus on performance only. It is unnecessary to have better performance than conventional one. Therefore, material design required more careful insight for reliability. Another example is material design concerns related to semiconductor packages. Main reasons of failures in semiconductor packaging are usually due to initial failures by molding process in manufacturing i.e. reflow soldering process and reflow sealing process using resin materials, and wear-out by aging. Fig.1 shows the various factors affecting the sealing process failure. Initial failures due to reflow process often appear as warpage.

Fig.1 Typical issues in semiconductor encapsulation process

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Contents:

• Introduction
• Virtual Material Test Using Homogenization Method
• Analytical Examples
  • - Prediction of elastic modulus, thermal expansion coefficient and strength of resin with filler.
  • - Evaluation of filler-filled resin mounting on semiconductor package.
• Conclusion and references

Multiscale.Sim offers robust virtual material testing capabilities through the homogenization method, and comes with a number of material microstructure templates.

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Virtual material testing, Homogenization, Multiscale analysis, Reliability design, Semiconductor package, Thermal cycle, Strength, Filler dispersed composites, Warpage